USM AND PENSONIC SIGN MOU TO STRENGTHEN RESEARCH AND BOOST GRADUATE EMPLOYABILITY
BUKIT MINYAK, PENANG, 15 July 2024 – Universiti Sains Malaysia (USM) and PENSONIC have agreed to establish cooperation by signing a Memorandum of Understanding (MoU) to enhance the talent pool.
This MoU aims to mutually benefit university graduates and the industry by advancing essential skills, particularly in engineering.
The collaboration focuses on joint research and product development activities, leading to innovative outcomes.
Additionally, the industry will provide internship opportunities for undergraduates, allowing them to gain hands-on experience before graduation and entering the job market.
The MoU was signed by the USM Vice-Chancellor, Professor Dato’ Seri Ir. Dr. Abdul Rahman Mohamed, and witnessed by His Excellency Tun Dato’ Seri Utama Ahmad Fuzi bin Haji Abdul Razak, Yang di-Pertua Negeri (TYT) of Penang; and USM Board of Governors Chairman, Dato’ Seri Dr. Awang Adek Hussin. Representing PENSONIC was Group CEO, Dixon Chew Chuon Jin.
According to Abdul Rahman, “This partnership signifies a profound commitment to academic and industrial excellence, and local corporate engagement.”
“Together, we are paving the way for mutual growth and development, enhancing Malaysia's internal opportunities, and nurturing a holistic, progressive, and professional workforce for the future,” he said.
He added, “This strategic alliance exemplifies the dedication of both USM and PENSONIC to drive mutual growth and development, positioning Malaysia as a hub for academic and industrial innovation.”
The MoU signing ceremony was part of PENSONIC’s momentous event held here this morning to unveil two innovative products at their Global Headquarters, with the aim of expanding their brand presence across Southeast Asia.
The event was officiated by His Excellency Yang di-Pertua Negeri of Penang.
Also present was the Dean of USM School of Electrical and Electronic Engineering, Professor Ir. Ts. Dr. Shahrel Azmin Sundi@Suandi.
- Created on .
- Hits: 638