USM NEWS PORTAL 

English News

USM-HP SEAL STRATEGIC COOPERATION, DRIVING THE NATION'S FUTURE TECHNOLOGY AND ENGINEERING TALENT

USM PENANG, 19 May 2026 - Universiti Sains Malaysia (USM) continues to move forward in strengthening the higher education and industry ecosystem by signing a Memorandum of Understanding (MoU) with HP Malaysia Manufacturing Sdn. Bhd. (HPMM) in a strategic partnership expected to open a new chapter in the development of the nation's technology and engineering talent.

The MoU signing ceremony marked an important point in strengthening academic and industry relations through various high-impact initiatives involving talent development, industry-based learning, and the strengthening of future technologies.

USM Vice-Chancellor, Professor Dato' Seri Ir. Dr. Abdul Rahman Mohamed, said the cooperation creates a strategic framework between academia and industry that will greatly benefit the university's engineering community, particularly the USM School of Electrical and Electronic Engineering.

According to him, the cooperation will be strengthened through the implementation of the Industry-Infused Incubator (MRI3) and Industry-Infused Programme (IIP) to produce intellectually capable, balanced, and competent graduates for the real world of work.

"This platform will provide high-impact industrial training experience, industry-supported final-year projects, and real hands-on work experience capable of improving student employability," he said.

Abdul Rahman also stressed that the integration of HP Malaysia's expertise into USM's 'Industry in Campus' ecosystem will bridge the gap between academic knowledge and industry practice.

"In fact, students will receive direct exposure to high-technology production, Industry 4.0 applications, robotics, and automation to ensure that they are truly ready to meet the needs of today's industry," Abdul Rahman added.

Meanwhile, at the same ceremony, Managing Director of HP Malaysia Manufacturing Sdn. Bhd., Dominic Chew, said the signing of the MoU was not merely a formal agreement, but reflected a shared belief in the power of collaboration between industry and academia in shaping future talent, accelerating innovation, and strengthening Malaysia's high-technology manufacturing ecosystem.

According to him, HP Malaysia Manufacturing, which operates in Batu Kawan, Penang is one of HP's main manufacturing facilities globally, producing inkjet printheads with the support of Industry 4.0 capabilities including automation, data analytics, and digital manufacturing systems.

"This cooperation covers various key areas which include industry exposure and site visits, industrial training and career opportunities, final-year and Capstone projects, support for STEAM initiatives such as ROBOCON, and upskilling programmes in line with Industry 4.0," he explained.

Dominic Chew added that HP sees this cooperation as a long-term investment not only in students, but also in the future of the nation's engineering capabilities.

"The combination of USM's academic strength and research excellence with HP's industry expertise and global perspective is believed to be capable of producing a more competitive generation of technology talent ready to face future challenges," he said.

The ceremony concluded with the presentation of a contribution amounting to RM10,000.00 by HP Malaysia Manufacturing to the USM ROBOCON team, comprising Electrical and Electronic Engineering students, as a manifestation of the company's commitment to supporting student talent development and technological innovation, particularly in strengthening the team's preparations for the upcoming national-level Robot Contest (ROBOCON).

Also present at the ceremony were Director of the Tuanku Syed Sirajuddin Engineering Campus, USM, Professor Ir. Dr. Mariatti Jaafar @ Mustapha; Engineering Director, HP Malaysia Manufacturing Sdn. Bhd., Lee Nget Ham; Chief of Staff and Manager of the Planning and Strategy Department, HP Malaysia Manufacturing Sdn. Bhd., Ng Kok Seong; and representing the Dean of the USM School of Electrical and Electronic Engineering, Associate Professor Dr. Muhammad Nasiruddin Mahyuddin.

 

Original Text: Mohd Azrul Mohd Azhar/Translation: Mazlan Hanafi Basharudin/Photo: Mohd Fairus Md Isa


Pusat Media dan Perhubungan Awam
Media and Public Relations Centre

Level 1, Building E42, Chancellory II, Universiti Sains Malaysia, 11800, USM, Pulau Pinang, Malaysia
Tel : 04-653 6495 | Emel : This email address is being protected from spambots. You need JavaScript enabled to view it. |  Web : www.usm.my

All Rights Reserved. Universiti Sains Malaysia © 2025