USM PENANG, 8 May 2026 - Universiti Sains Malaysia (USM), through its Collaborative Microelectronic Design Excellence Centre (CEDEC), has signed a Memorandum of Understanding (MoU) with the Indonesia Chip Design Collaborative Center (ICDEC) to strengthen the regional semiconductor ecosystem.

The MoU ceremony, held at the Consulate General of the Republic of Indonesia here yesterday, was also seen as a strategic step to expand cooperation in the development of high-impact technology between Malaysia and Indonesia.

Director of CEDEC USM, Professor Dr. Asrulnizam Abd Manaf, said the cooperation reflects the shared commitment of both countries in driving technological development that supports future digital economic growth.

According to him, the collaboration focuses on talent development, research, and innovation in integrated circuit (IC) design, microelectronic systems, and advanced semiconductor technology at the ASEAN level.

"This cooperation also opens opportunities for sharing expertise and infrastructure, as well as implementing joint training and research programmes between the two institutions," he said in his speech at the ceremony.

Also present were Vice-Chair of ICDEC Indonesia, Dr. Permata Nur; Director of the Tuanku Syed Sirajuddin Engineering Campus, who also represented the USM Vice-Chancellor, Professor Ir. Dr. Mariatti Jaafar @ Mustapha; and Chief Executive Officer of GreatAsic Sdn. Bhd., Ong Chin Hu among others.

In addition to its cooperation with ICDEC, CEDEC also expanded its strategic network through another MoU signing with GreatAsic Sdn. Bhd., further strengthening the tripartite cooperation in the semiconductor field.

The ceremony also marked the readiness of all parties to empower the development of the regional semiconductor industry through integrated sharing of expertise, research, and technology development.

Original Text & Photo: Collaborative Microelectronic Design Excellence Centre (CEDEC), USM/Translation: Mazlan Hanafi Basharudin