USM PENANG, 21 September 2025 – Universiti Sains Malaysia (USM) is proud to announce the launch of two new postgraduate programmes for the 2025/2026 academic session: Master of Science (MSc) in Advanced Semiconductor Packaging and Master in Cybersecurity.

These programmes are designed to equip graduates with advanced knowledge and practical skills that meet the evolving needs of industry and national development priorities.

Both programmes are closely aligned with the National Artificial Intelligence (AI) Action Plan 2026 to 2030 and play a key role in supporting Malaysia’s aspirations to become a regional leader in semiconductors, digital transformation, and high-value technology sectors.

According to the Vice-Chancellor of USM, Professor Dato’ Seri Ir. Dr. Abdul Rahman Mohamed, "These programmes reflect USM’s ongoing commitment to producing talent that is not only academically capable but also industry-ready.”

“As Malaysia accelerates its push towards becoming a leader in semiconductors and digital innovation, USM will continue to support this vision by aligning our academic offerings with real-world applications and national strategic priorities," he added.

Master of Science in Advanced Semiconductor Packaging

This interdisciplinary programme is developed in close collaboration with multiple schools within USM and key players in the semiconductor industry.

It offers students deep technical expertise and hands-on training in areas such as advanced chip-package-board co-design, product failure analysis, and research methodology.

The curriculum integrates industry-informed content, ensuring graduates are well-prepared to contribute to one of the world’s most dynamic and fast-moving sectors.

The programme is open to candidates with a background in science, technology, or engineering and is available in both full-time and part-time modes to accommodate a range of learners.

Master in Cybersecurity

In an era of increasing cyber threats and digital vulnerabilities, this programme provides students with a comprehensive understanding of cybersecurity principles and practices.

The curriculum covers key areas such as cyber risk assessment, secure systems design, and incident response.

A strong emphasis is placed on hands-on experience and real-world problem-solving, enabling graduates to take on critical roles in safeguarding digital ecosystems.

The programme is structured to suit both fresh graduates and working professionals who wish to advance their expertise in this critical field.

Driving Industry-Relevant Talent Development

Both programmes affirm USM’s commitment to application-driven education and strategic industry alignment.

Delivered in a flexible hybrid format, they are accessible to full-time students as well as working professionals.

Additionally, admission through APEL A (T-7) opens doors for experienced professionals and lifelong learners who may not follow traditional academic pathways.

With the introduction of these programmes, USM continues to strengthen its position as a leading institution that bridges academia, research, and industry.

By nurturing talent with both theoretical knowledge and practical skills, USM is contributing directly to the development of Malaysia’s future-ready workforce.

For more info:

Master of Science in Advanced Semiconductor Packaging

https://admission.usm.my/index.php/postgraduate/programmes?view=article&id=892&catid=54

Master in Cybersecurity - Coursework

https://admission.usm.my/index.php/postgraduate/programmes?view=article&id=883&catid=51

Text: Division of Academic & International, USM/ Editing: Assoc. Prof. Dr. Shaik Abdul Malik Mohamed Ismail