BAYAN LEPAS, PENANG, 7 August 2025 – Universiti Sains Malaysia (USM), through the Collaborative Microelectronic Design Excellence Centre (CEDEC), played a central role in organising the 32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2025, held from 5 to 8 August at the Setia SPICE Convention Centre, Penang.

The prestigious international symposium was jointly coordinated with IEEE Reliability, Electronics Packaging, and Electron Devices Singapore Chapter (RS/EPS/EDS); and Universiti Kebangsaan Malaysia’s Institute of Microengineering and Nanoelectronics (IMEN), attracting strong support from industry giants including Intel, AMD, Sandisk, Infineon, Qualcomm, NXP, and ASE.

More than 150 technical papers were submitted, with 70 percent from abroad; highlighting Malaysia’s growing footprint in semiconductor research and its relevance to global stakeholders.

The event featured keynote lectures, technical presentations, workshops, and tutorials from leading academics and industry figures, focusing on advanced integrated circuit (IC) design, failure analysis, and packaging.

USM also hosted a one-day educational workshop tailored for undergraduate and postgraduate students in Integrated Circuit (IC) and Failure Analysis (FA), attracting 130 participants from local and international institutions.

“USM, through CEDEC, has taken strategic steps through collaborative research and talent development, including partnerships with the Taiwan Semiconductor Research Institute and Intel Foundry Services, and is spearheading the national IC design apprenticeship programme supported by the Ministry,” said Minister of Higher Education, Dato’ Seri Diraja Dr. Zambry Abd Kadir, who officiated the event.

CEDEC is also expanding national access to Electronic Design Automation (EDA) tools for universities, enabling shared learning, collaborative research, and advanced design capabilities across the country.

The showcase exhibition, sponsored by Thermo Fisher Scientific (Platinum), Zeiss, Siemens, and other leading tech firms, displayed end-to-end semiconductor technologies, providing hands-on insight into Malaysia’s strengths in backend semiconductor processes.

This aligns closely with Malaysia’s National Semiconductor Strategic (NSS) Plan and the Silicon Vision 2030 agenda, positioning the country as a global semiconductor hub through skilled talent and university-industry synergy.

 

By anchoring IPFA 2025, USM continues to cement its role as a regional leader in microelectronic design education, while accelerating Malaysia’s trajectory in high-tech innovation and talent development.

Also in attendance were the Secretary General of the Ministry of Higher Education (MoHE), Datuk Dr. Anesee Ibrahim; MoHE Deputy Secretary General (Policy), Dato’ Dr. Hj. Megat Sany Megat Ahmad Supian; Director-General of Higher Education, Datuk Professor Dr. Azlinda Azman; IPFA 2025 General Chair, Dr. Ng Chi Yung; CEDEC Director and IPFA 2025 General Co-Chair, Professor Dr. Asrulnizam Abd Manaf; senior officials from MOHE; key officers from USM; and prominent industry leaders and strategic partners.

Text: Shafinaz Md Ismail/ Photo: Muhamad Faris Darwisy Mohammad Rafiq