PENANG, 6 June 2024 – Universiti Sains Malaysia (USM) today has set another significant milestone in its pursuit to strengthen ties with Intel through the signing of “Intel Advanced Packaging Research Grant 2024”.

In a significant step towards enhancing university-industry collaboration, the Intel grant will focus on research in advanced packaging.

A total of 27 applications were submitted for this highly competitive project, out of which 8 have been selected for the first phase. Subsequent phases will be provided by Intel, offering further opportunities for innovation and collaboration.

Signing on behalf of USM was its Vice-Chancellor, Professor Dato’ Seri Ir. Dr. Abdul Rahman Mohamed, while from Intel was its Vice President of Disaggregation Manufacturing, Chris Kenyon. Also present were the Director of USM Industry Network, Associate Professor Dr. Shaizatulaqma Kamalul Ariffin, delegates from Malaysian Investment Development Authority (MIDA) and Universiti Malaysia Perlis (UniMAP).

This initiative is set to provide a substantial boost to researchers, fostering deeper cooperation between universities and industry in research and technological innovation.

The collaborative efforts are expected to yield benefits for both the academia and industry, driving advancements in technology and knowledge.

USM has expressed its commitment towards supporting this initiative. As part of the collaboration, USM will provide quality Graduate Research Assistants (GRA) and offer matching grants to support these projects in ensuring the successful execution and advancement of the selected research endeavours.

This initiative underscores USM's dedication towards enhancing research capabilities and fostering innovation through strong industry partnerships.

Text: Eliza Yasmin Dahlan, Industry Network Office, BJIM USM